Home News Intel and UMC join forces for 12-nanometer semiconductor

Intel and UMC join forces for 12-nanometer semiconductor

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Intel and UMC join forces for 12-nanometer semiconductor


Intel Corp. and United Microelectronics Company (UMC) have joined forces in a big transfer that’s poised to reshape the panorama of the semiconductor business. They’re working collectively to create a brand new 12-nanometer semiconductor course of platform, a improvement that’s eagerly anticipated by markets that rely closely on superior know-how, akin to cellular gadgets, communication infrastructure, and networking. This collaboration is a strategic mix of Intel’s manufacturing prowess and UMC’s specialised course of data, which is anticipated to supply prospects extra superior choices and bolster the availability chain throughout varied areas.

On the coronary heart of this partnership is the event of a 12-nanometer course of platform that comes with FinFET know-how. This know-how is understood for delivering excessive efficiency and power effectivity, that are important components in right now’s fast-paced and power-conscious market. Intel is about to convey its manufacturing experience and FinFET design data to the desk, whereas UMC will contribute its course of improvement expertise, together with offering a Course of Design Package (PDK) and design assist companies. The objective of this three way partnership is to create a course of platform that can stand out within the aggressive semiconductor market.

12-nanometer semiconductor

The manufacturing of this new know-how is scheduled to start in 2027 at Intel’s Ocotillo Expertise Fabrication facility situated in Arizona. This strategic location will enable the partnership to reap the benefits of the prevailing infrastructure, optimizing funding and useful resource utilization. The collaboration goes past simply manufacturing; it additionally encompasses design enablement, specializing in digital design automation and mental property options. This ensures that the 12 nm course of might be able to assembly the intricate calls for of future semiconductor purposes.

“Taiwan has been a important a part of the Asian and international semiconductor and broader know-how ecosystem for many years, and Intel is dedicated to collaborating with modern corporations in Taiwan, akin to UMC, to assist higher serve international prospects,” mentioned Stuart Pann, Intel senior vp and normal supervisor of Intel Foundry Companies (IFS). “Intel’s strategic collaboration with UMC additional demonstrates our dedication to delivering know-how and manufacturing innovation throughout the worldwide semiconductor provide chain and is one other vital step towards our objective of changing into the world’s second-largest foundry by 2030.”

Jason Wang, UMC co-president, mentioned, “Our collaboration with Intel on a U.S.-manufactured 12 nm course of with FinFET capabilities is a step ahead in advancing our technique of pursuing cost-efficient capability growth and know-how node development in persevering with our dedication to prospects. This effort will allow our prospects to easily migrate to this important new node, and likewise profit from the resiliency of an added Western footprint. We’re excited for this strategic collaboration with Intel, which broadens our addressable market and considerably accelerates our improvement roadmap leveraging the complementary strengths of each corporations.”

Intel’s involvement on this enterprise is a important a part of its bigger objective to safe its place because the world’s second-largest foundry by the tip of this decade. This ambition is supported by substantial investments in manufacturing services throughout the globe. UMC, with its over 40 years of expertise as a foundry service supplier and a strong presence in Asia, brings to the desk its experience in mature know-how nodes and specialty processes. The partnership is a testomony to each corporations’ dedication to pushing ahead their improvement methods and increasing their affect available in the market.

The alliance between Intel and UMC on the 12-nanometer semiconductor course of platform is a strategic transfer that guarantees to ship a potent, environment friendly, and versatile answer to satisfy the evolving wants of high-growth markets. With a well-defined manufacturing timeline and a complete strategic plan, this collaboration is about to drive innovation and progress for each Intel, UMC, and their prospects. The semiconductor business is on the point of a brand new period, and this partnership is on the forefront, able to ship the subsequent wave of technological developments.


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